QianLi iPhone 16 SERIES 4 In 1 Middle Layer Reballing Platform

Qianli 4-in-1 Magnetic Middle Layer Reballing Platform for iPhone 16/16 Plus/16 Pro/16 Pro Max mid-frame tin planting repair. Qianli iPhone 16 series middle frame tinning station with BGA stencil for iPhone motherboard layering and bonding.

Features:
1. Qianli 4-in-1 middle frame reballing platform with middle layer stencils for iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard precise positioning repair, strong magnetic pressing with no bulge.
2. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take.
3. High temperature magnet, strong magnetic attraction, accurate positioning no offset encountering the high temperature magnetism will not weaken.
4. Stencils with no bulge under high temperature, high temperature magnetic strong pressing, prevent the stencils from bulging caused by high temperature.
5. Made ofimported high quality steel material, imported selection of high quality steel material. Manufacture under QianLi black stencils standard Wear resistance, ultra high toughness to support reballing.
6. Rounder and fullertin balls, square chamfer mesh, prevent the tin balls from being stuck in the mesh.
7. To show the beauty of design in a compact shape, motherboard reballing without worry compact and easy, saving space.

User’s Guide: 
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the correspondingpositioning pins. Place it in the synthetic stone base, Install SIM card baffle.
Step 2: Install stencils. Align the stencils ofthe corresponding model with the positioningpinsand put it into the base.
Step 3: Apply solder paste. Apply the solder paste at the corresponding temperature to the reballing hole, make surethat each hole is covered with solder paste.
Step 4: Heatevenly. Combine the top cover of the product with the base and operate, Use the hot air gun to heat the corresponding reballing hole.

Product Parameters:
Brand: QianLi
Material: Synthetic stone, steel
Model: for iPhone 16/16 Plus/16 Pro/16 Pro Max
Features: Motherboard reballing, repair.