General mobile phone maintenance fixture, rotary fixed design, no rebound, fixed firmly
Prevent clamps from moving during use, special anti-skid pad
Let the hot air can be discharged more efficiently, add heat sink to the bottom of the clamp
Rotary shaft locks the motherboard or IC more efficiently, fixed well without a rebound
Fixtures also support IC type fixtures fixed for the removal of back glue, the clamp is designed to bear the force of the IC beam, which can hold up the empty parts of the IC well and avoid the IC breaking when removing black glue
The fixture can be adjusted at different distances from the high, middle, and low levels. It’s necessary to loosen the two screws at the bottom, move the fixing plate to the appropriate gear position, and then tighten the bottom screws to lock it
Protect the upper and lower layers of the double-layer motherboard during maintenance
Suitable for mobile phone motherboards of various sizes and shapes
Suitable for fixing when cleaning large chips such as CPU and NAND
