All Products
2UUL STENCIL IPHONE 11/11P/11PM
Original price was: ₹335.00.₹150.00Current price is: ₹150.00.
A10 3D STENZIL
₹649.003D BGA Stencil is compatible with the following models of Cell phones: Apple iPhone 7 Apple iPhone…
B&R IP A06 X TO 11 Series Middle Layer Motherboard Tin Planting Platform
Original price was: ₹1,199.00.₹750.00Current price is: ₹750.00.B&R IP-A06 Middle Layer Motherboard Tin Planting Platform for iPhone X/XS/XS Max/11/11 Pro/11Pro Max Features: iPhone middle…
BAIYI DS-201A Macbook Ball Planting Platform for CPU/GPU/PCH/BGA Chips
Original price was: ₹11,469.00.₹9,000.00Current price is: ₹9,000.00.
DS-201B Macbook Ball Planting Platform for PMU SMC T1 T2 RAM NAND WIFI Power BGA Chips
Original price was: ₹13,899.00.₹10,500.00Current price is: ₹10,500.00.
MECHANIC IBGA 13 MAX 14-IN-1 MOTHERBOARD MIDDLE LAYER REBALLING PLATFORM FOR IPHONE X TO 13 PRO MAX
₹2,200.00MECHANIC IBGA13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X…
MECHANIC IBGA 13 PROMAX
Original price was: ₹2,399.00.₹1,500.00Current price is: ₹1,500.00.
Mechanic IBGA 15 Mid-level Positioning Ball-Planting Platform for iPhone 15 Series
Original price was: ₹700.00.₹600.00Current price is: ₹600.00.Mechanic IBGA 15 Mid-level Positioning Ball-Planting Platform for iPhone 15 Series
MiJing C17 3in1 Main Board Middle Layered Function Testing Fixture for iPhone X / Xs / Xs Max
Original price was: ₹6,500.00.₹6,100.00Current price is: ₹6,100.00.MiJing C17 Main Board Middle Layered Function Testing Fixture for iPhone X / Xs / Xs Max…
MiJing C18 for iPhone 11/11Pro/11ProMax Main Board Function Testing Fixture
Original price was: ₹6,500.00.₹6,200.00Current price is: ₹6,200.00.Feature: Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speed Check in advance to avoid duplicate disassembling and breaking the motherboard Small size, easy to carry. Operational Process: 1, Prepare Power On/Off Cable*1 Power Line*1 LCD Test Cable*1 Screen*1 Main Board*1 2, Decomposition iPhone 11/11p/11pro Middle Layer simply equipped the test fixture. 3, Install: Put in the lower main board, put on the pin board, put the top board in, and then cover the test rack. 4, The first way to connect the screen line,boot,power cord or battery test ink success or not. The second way is to connect the end plug on the base of the first method to implement the brush function.
Mijing Z20 Pro BGA Rework Stencils 14in1 for iPhone Motherboard Soldering
₹3,400.00MJ 14 in 1 BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture…
