Brand:

B&R
Sale!

B&R IP A06 X TO 11 Series Middle Layer Motherboard Tin Planting Platform

Price Original price was: ₹ 1,199.00.Current price is: ₹ 749.00.

Description

B&R IP-A06 Middle Layer Motherboard Tin Planting Platform for iPhone X/XS/XS Max/11/11 Pro/11Pro Max

Features:

  • iPhone middle layer tin planting platform, support iPhone X/XS/XS Max/11/11 Pro/11Pro Max middle layer and RF tin planting network
  • Strong magnetic adsorption / precise positioning / double-sided design / fast tin planting
  • Double-sided self-alignment design, support Phone X/XS/XS Max/11/11 Pro/11Pro Max RF tin planting
  • Made of high-quality materials, resistant to high temperature of 700 degrees Celsius, no drum, no reflection, not easy to deform
  • High precision and precise alignment, compatible with many models
  • Slot type strong magnetic adsorption, strong magnetic plus steel mesh and bonding pad, automatic positioning without offset
  • The design of rounded and square holes makes the steel mesh easier to remove tin, easier to plant tin, more durable and more efficient

 

Package includes:

  • 1 x Tin-planting platform
  • 5 x Stencil
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