Features:

•  High rigidity and flexibility
•  Hand-sharpened blades
•  5 models, each 1 pcs
•  A variety of models meet the needs of different scenarios for mobile phone repair
•  Bach1.0: pry to remove the glue from IC and CPU
•  Bach2.0: corner knife scraping IC peripheral glue
•  Bach3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
•  Bach4.0: prying IC hard disk
•  Bach5.0: prying CPU IC hard disk and CPU layering