Applicable to IP/Android mobile phones, laptops, desktop computers, graphics card processors, and various modules with high thermal conductivity requirements.

Thermal conductivity of 6.0 W/MK, resilience to heat and humidity, and resistance to environmental aging. Allowing electronics to easily handle the heat produced by powerful CPUs and GPUs.

Possesses good insulation, is non-conductive, and prevents corrosion of different heat dissipation parts.

Limited fluidity, good plasticity, compressible voids, and limited deformability.

Clear the CPU’s surface of any debris, etc. Then apply the proper amount of thermal grease on the CPU by squeezing it out into an even layer.